DARPA (MTO): ELectronics for G-band ARrays (ELGAR)

The ELGAR program seeks to develop integration technologies needed to create compact, high performance III-V RF electronics to enable communication and sensing systems at G-band frequencies. These integration technologies include dense, silicon-like, on-chip BEOL and lowloss

chip-to-chip interconnects.

Technical Challenge 1: Achieving efficient, compact G-band MMICs with high output power density

Technical Challenge 2: Achieving low-loss off-chip interconnects between adjacent G-band array components

 

 

 

Funding: no fixed limit 

Duration: 4 years 

 

 

Research Authority due date: 24.10.21

Abstract (strongly encouraged) due date: 29.10.21

Full proposal due date: 13.12.21