DARPA: Optimum Processing Technology Inside Memory Arrays (OPTIMA)
קרן | US Department of Defense |
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מדינה | U.S.A. |
סוג | Research Grants |
תאריך אחרון | 17/05/2023 |
פקולטה | Engineering, Exact Sciences |
תיאור | To enable CIMAs with 300 TOPS/W computational power efficiency and 20 TOPS/mm2 computational area density (15X and 4X higher than the state-of-the-art respectively), the performers in OPTIMA program should simultaneously address the following two Technical Challenges (TCs): TC1: Achieving a small, power-efficient MCE TC2: Achieving a small, scalable, and power-efficient MAM architecture.
Funding: no fixed limit Duration: 54 months
Research Authority due date: 14.3.23 Abstract (strongly encouraged) due date: 21.3.23 Full proposal due date: 17.5.23 |
קבצים מצורפים | |
קישור | לאתר |
עדכון אחרון | עדכון אחרון: 22/02/2023 |