DARPA: Miniature Integrated Thermal Management Systems for 3D Heterogeneous Integration (Minitherms3D)
| קרן | US Department of Defense |
|---|---|
| מדינה | U.S.A. |
| סוג | Research Grants |
| תאריך אחרון | 22/02/2023 |
| פקולטה | Engineering, Exact Sciences |
| תיאור | The Minitherms3D program seeks to revolutionize thermal management for three-dimensional heterogeneous integration (3DHI). This program seeks to significantly reduce thermal resistances within the 3D stack and external to the stack of 3DHI systems, while increasing volumetric heat removal.
Funding: no fixed limit Duration: 4 years
Research Authority due date: 15.2.23 Abstract (strongly encouraged) due date: 22.2.23 Full proposal due date: 11.4.23 |
| קבצים מצורפים | |
| קישור | לאתר |
| עדכון אחרון | עדכון אחרון: 24/01/2023 |
