DARPA: Low Temperature Logic Technology (LTLT)

The Microsystems Technology Office at DARPA seeks innovative proposals for the research and development of a high-performance device/circuit technology that is optimized for operation at a temperature of 77K, enabling operation at low power supply voltage to reduce power dissipation. It is envisioned that this Low Temperature Logic Technology (LTLT) program will be fabricated in complementary metaloxide- semiconductor (CMOS) through modifications to advanced very large scaled integration (VLSI) processes.

 

TA1: Low Temperature Logic Technology Demonstration

TA2: Advanced Device and Circuit Architecture Exploration

 

 

Funding: No fixed limit 

Duration: 4 years

 

Research Authority due date: 18.3.21

Abstract (highly encouraged) due date: 2.4.21

Full proposal due date: 18.5.21